3D Silicon and Glass Interposers market research report available

PRLog (Press Release) – Oct 24, 2010 – ReportBuyer.com has added a new report

This report first focuses on the driver applications and the associated drivers by application. for each application, we simulate costs and compare them with projected market prices, we compare the 3D si/glass interposer solution with existing and other emerging alternatives and we derive detailed market and wafer forecasts.

Will 3D silicon/glass interposers be an intermediate step to 3D TSV's in active IC's, or is this a long term trend? How will the supply chain evolve to serve these emerging technologies? These are the questions we address in this first-ever dedicated report on 3D glass/silicon interposers. despite the emerging character of the 3D silicon/glass interposer solutions and the associated uncertainties, this report brings clear answers as to which applications and uses they are likely or unlikely to support in the future, and whether these will stay niche or rather expand to high volume manufacturing.

Key Features of The Report

Detailed account of all the application fields of 3D interposers (examples are logic, logic+memory, 3D RF/analogue integrated passive and MEMS capping interposers...)

Drivers and expected benefits by application

Comparison with technology alternatives and likeliness of 3D interposer penetration by application

Market trends and figures with breakdown by application, substrate type, wafer and panel size

Analysis of target wafer prices for a few key applications

Cost analysis of several technology and industrial cases

Supply chain analysis: main manufacturers and contract assemblers for 3D interposers, likely high volume players. Design, test and liability considerations

Companies Cited in The Report

AAC Microtec, Allvia, AMD, Altera, Amkor Technology, APM, ASE, ASET, Avago Technologies, Bridgelux, CEA-LETI, ChipMOS, Cree, Corning, Dai Nippon Printing, Dalsa, Discera, Elpida, Epcos, Epistar, EPWorks, Fraunhofer IZM, Georgia Tech, Hitachi , Hymite, Hynix, Ibiden, IBM, IME, IMT, Infineon Technologies, Intel, Ipdia, Liquid Design Solutions, LG Innotek, Lumileds, Maxim, Micron, Nanium, National semiconductor, NEC / Schott, Nepes, Nichia, Nippon Electric Glass, Nokia, NXP Semiconductors, on Semiconductors, Panasonic, Qualcomm, Renesas, Replisaurus Technologies, Samsung, Schott, Sensonor, Shinko Electric, Silex Microsystems, SMIC, Soitec, Sony, StatsChipPac, STEricsson, STMicroelectronics, Süss Microtec, Tecnisco, Texas Instruments, TMT, Toshiba, TSMC, UltraTech, UMC, UTAC, VTI Technologies, WLCSP, Xilinx, Xintec

3D Silicon and Glass Interposers: Next Generation Package Substrates: 3D Silicon and Glass Interposers Technologies, applications and markets published is available at:

http://www.reportbuyer.com/computing_electronics/manufac