Beneq, a leading supplier of ALD equipment and thin film coating services, has announced two new thin film equipment solutions for industrial customers that require high capacity and low process cost in advanced ALD applications.
According to the company, the new products are set to revolutionize the standards of coating speed in the ALD industry.
Beneq R11™ – Ultra-fast high precision spatial ALD coating
Beneq R11 is the latest addition to Beneq’s extensive portfolio of large-throughput spatial ALD solutions for industrial use. It provides an optimal solution for high performance ALD on wafers in industrial applications, such as optical coatings, insulators and barriers. It is the ideal choice of equipment when speed, cost, low process temperature and the highest possible film quality are the driving factors.
With Beneq R11, it is for the first time possible to use PEALD (Plasma Enhanced ALD) processes in high volume manufacturing. The system lends itself to barrier, insulation and anti-corrosion applications for MEMS, LED, OLED, photovoltaics, high power semiconductors, sensors and many other components.
The equipment is suitable for up to 200 mm wafers and other round or rectangular substrates. The plasma enhanced rotary ALD process of Beneq R11 is ideal for thick ALD films, in the micrometer thickness range. Beneq R11 can also be equipped with standard wafer automation.
Beneq T2S™ – Automated batch wafer equipment
Beneq T2S is the newest member of Beneq’s wafer-based production equipment portfolio. It offers a unique combination of high capacity batch processing and standard cassette-to-cassette automation. The Beneq T2S is specifically engineered to match the semiconductor requirements, including the SEMI S2 safety requirements and low particle counts.
Beneq T2S is perfectly suited for high volume manufacturing in various wafer-based applications, including MEMS, LED, OLED, ink-jet print heads and more. The thermal batch ALD process of Beneq T2S is ideal for oxide and nitride processes used for dielectric, conductor, barrier and passivation purposes.
