SCHOTT and Primoceler join forces to advance the next generation of ultra-miniature, ultra-reliable medical implants

The technology group SCHOTT has entered into an agreement to acquire Primoceler Oy to expand its hermetic packaging portfolio with pioneering glass micro bonding technology. This process enables the manufacture of vacuum-tight, ultra-miniature electronic and optical devices with superior reliability. Based on laser technology, this state-of-the-art bonding method can be completed without any heat or added materials, allowing device packaging for sensitive electronics made with only transparent materials, such as glass. Offering excellent biocompatibility with new glass types, the technology creates new possibilities for wafer level chip scale packaging (WL-CSP) in a wide range of applications, including medical implants, MEMS devices, and other reliability-critical electronic and optical devices.

Advancements in the medical industry, particularly for implantable devices, have led to the development of a new type of smart active implants. These implants are more intelligent: they have the ability to transmit and capture data and can also be equipped with optical components, such as optical sensors or cameras. Subsequently, these sensitive components must be safely encapsulated to protect against potentially damaging working environment hazards (such as humidity, extreme temperatures, corrosive chemicals, and bodily fluids) while still delivering high-level electrical performance and smooth transmission of optical and radiofrequency signals.

The innovative glass micro bonding services offered by Finnish pioneer Primoceler Oy allows the manufacture of truly reliable miniature packages for implantable devices made only with glass. By directly laser bonding glass-to-glass or glass-to-silicon, devices can be manufactured without a gap between the layers, leading to ever-smaller wafer and chip scale devices and medical implants. In addition, the process allows for creation of specified conditions inside the encapsulation cavity, including integration of certain gases or even a complete vacuum.

This unique solution for glass micro bonding does not require any heat and can be done at room temperature, creating the possibility for electronics with extreme heat sensitivities to be safely encapsulated. The bonding process also does not require any additive materials, which means less risk for material failure or outgassing, and therefore enhanced reliability of the packaged components.

For the past 40 years, titanium has been the packaging material of choice for medical implants. However, the use of glass wafers has increased rapidly in recent times. The core reasons are the superior properties glass offers as a packaging material, including its biocompatibility. Its excellent transparency to radio frequencies (RF) opens up new possibilities for active and passive medical implants, since glass packages could enable efficient recharging, data transfer, and reprogramming of implants.  Furthermore, transparency to visible light makes full-glass micro packages suitable for a wide range of optical applications.